interconnects 1,27 grid single and double ro w w w w . m i l l - m a x . c o m ? 5 1 6 - 9 2 2 - 6 0 0 0 70 series 850, 851 852, 853 (number of pins x 1,27) + 0,38 (number of pins x 1,27 /2) + 0,38 (number of pins x 1,27 ) + 0,38 (number of pins x 1,27 /2) + 0,38 fig. 1 fig. 2 (number of pins x 1,27 ) + 1,02 or dering inf ormation single ro w 2,21 pr ofile pin header 850-xx-0_ _-10-001000 double ro w 1,91 pr ofile pin header 852-xx-_ _ _-10-001000 single ro w 4,09 pr ofile soc ket 851-xx-0_ _-10-001000 double ro w 4,09 pr ofile soc ket 853-xx-_ _ _-10-001000 single ro w 4,7 pr ofile soc ket 851-xx-0_ _-10-002000 fig. 3 fig. 4 fig. 5 specify # of pins 01-50 specify # of pins 002-100 specify # of pins 01-50 specify # of pins 002-100 specify # of pins 01-77 fig. 1 fig. 2 fig. 4 fig. 5 fig. 3 ser ies 850 single and doub le ro w interconnects ha v e 1,27 pin spacing and per mit board stac king as lo w as 6,3. pin headers ha v e 0,41 dia. pins . (mm# 4006-0 s ee pa ge 166 f o r details). mm# 4890-0 and 0467 receptacles use m-m#11 hi-rel, 3-finger ber yl- lium copper contacts rated at 3 a mp s . (#11 contact accepts pin diameters from 0,38 - 0,51) insulators are high temp . ther mo- plastic , suitab le f or all solder ing operations . xx= plating code see bel o w xx= plating code see bel o w specify pl a ting code xx = 1 3 ? 91 93 99 4 1 ? 4 3 ? 4 4 ? slee v e (pin) contact (clip ) 200? sn/p b 200? sn 10? a u 10? a u pin plating specify pl a ting code xx = 1 0 ? 9 0 4 0 ? 2,21 0,41 0,41 3,0 2,21 2,9 1,27 0,41 3,05 3,0 1,91 2,11 3,0 0,41 1,27 1,27 2,21 1,91 3,05 4,09 2,51 0,46 1,27 3,05 1,91 3,05 0,46 4,01 2,59 1,27 1,27 1,78 1,91 3,81 4,7 2,92 0,46 1,27 0,25m au 5,08m sn/pb 5,08m sn 0,25m au 0,76m au 0,76m au 0,76m au 5,08m sn/pb 5,08m sn/pb 5,08m sn/pb 5,08m sn 5,08m sn 5,08m sn
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